Product descriptions 목록

TXZ CHAMBER As a vacuum chamber, it is used in the new semiconductor film process.
size : 400*400*250
ASP CHAMBER Also, after welding the water line in the vacuum chamber, it is processed.
It is the core chamber in the semiconductor ETCH process.
size : 300*300*200
CASSET STAGE(NERO) This is the STAGE on which the semiconductor case is placed.
It works semi-automatically.
size : 250*200*200
DTCU HOIST This equipment is used to lift the E-DTCU DOME of the semiconductor ETCH process.
It works with a switch.
size : 500*300*300
ULTIMA BASE It is the basic BASE that goes into ULTIMA equipment.
size : 400*500*200
UPPER CHAMBER It is a vacuum chamber that enters the semiconductor ETCH process.
size : 900*400*300
LOWER CHAMBER It is a vacuum chamber that enters the semiconductor ETCH process.
size : 900*400*500
VHP&VHP+ ROBOT SET It is a ROBOT SET for WAFER transfer that enters semiconductor ETCH CVD PVD process
size : 500*500*100
HP&HP+ ROBOT SET It is a ROBOT SET for WAFER transfer that enters semiconductor ETCH CVD PVD process
size : 350*350*200
LASER ASSY It is a product that enters the semiconductor ETCH CVD PVD process
which aligns the WAFER using a laser.
size : 150*120*200
DPS R1 CHAMBER It is the core plasma chamber of the semiconductor ETCH process.
size : 500Φ*800
DPS & POLY THROTTLE VALVE ASSY DPS & POLY THROTTLE VALVE ASSY
This is a THROTTLE VALVE set that goes into the semiconductor ETCH process.
size : 400*300*200

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